ELECTRONIC PACKAGING TECHNOLOGIES FOR THE FUTURE
Electronic Design and Manufacturing
Contract Assembly
Standard Memory Modules
An ISO 9001:2000 Registered Company
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ELECTRONIC PACKAGING TECHNOLOGIES FOR THE FUTURE Electronic Design and Manufacturing Contract Assembly Standard Memory Modules An ISO 9001:2000 Registered Company
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MULTICHIP MODULES
HDA utilizes ceramic and polymer materials technologies along with chip and wire assembly techniques to produce state-of-the-art microelectronic circuits.
PGA MCM Surface Mount and Thru-Hole Assemblies |
