High Temperature Packaging

HDA/SMC has developed unique capabilities and processes in high-temperature packaging through decades of engineering solutions to meet critical customer requirements.

Our engineers have built a well-deserved reputation for versatility in configuring our processes and quality-assurance techniques to provide packaging solutions that are at or near the limits of high-temperature electronic manufacturing.

Our depth of expertise allows us to meet most high-temperature requirements:

• Typical maximum temp: 175-200° C
  (Functionality at maximum temperature is always component dependent)
• Packaging up to 260 deg C
• Hermetic packaging with eutectic die attach for highest package temp ratings
• Gold and aluminum wire in various diameters available