ELECTRONIC PACKAGING TECHNOLOGIES FOR THE FUTURE
Electronic Design and Manufacturing
Contract Assembly
Standard Memory Modules
An ISO 9001:2000 Registered Company
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ELECTRONIC PACKAGING TECHNOLOGIES FOR THE FUTURE Electronic Design and Manufacturing Contract Assembly Standard Memory Modules An ISO 9001:2000 Registered Company
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HIGH TEMPERATURE
HDA combines the packaging technologies for hybrid circuits and mulitchip modules with proprietary materials and processes for hostile environments. Applications include down-hole instrumentation for 175-200 degrees C well-logging and aircraft engine instrumentation.
Surface Mount and Thru-Hole Assemblies |
