ELECTRONIC PACKAGING TECHNOLOGIES FOR THE FUTURE
Electronic Design and Manufacturing
Contract Assembly
Standard Memory Modules
An ISO 9001:2000 Registered Company
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ELECTRONIC PACKAGING TECHNOLOGIES FOR THE FUTURE Electronic Design and Manufacturing Contract Assembly Standard Memory Modules An ISO 9001:2000 Registered Company
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CUSTOM HYBRIDS
Chip on Board and Chip on Chip Assembly Utilizing many material and process technologies, HDA provides packaging solutions for customer specific applications.
Power Motor Controller Hybrid
Module Designed for 100,000 Angular Acceleration
Chip on Flex Surface Mount and Thru-Hole Assemblies |
